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>> INTEL CORPORATION Latest News

AUG 28, 2014 - AZoNano

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Intel Develops Embedded Multi-Die Interconnect Bridge Technology for 14nm Foundry Applications

Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies. Embedded Multi-die Interconnect Bridge...

Tags: Intel Develops Embedded Multi-Die Interconnect Bridge Technology for 14nm Foundry Applications,  Intel Corporation Latest News